Bar Fab - Shift D (Finance)
- Process InP semiconductor wafers in a cleanroom and ESD-safe environment
- Become certified in multiple process areas such as:
- Wafer sawing, dicing, singulation
- Wafer scribing, cleaving/breaking, expansion
- Die (bar) handling using tweezer and automated equipment
- Follow the process flow using traveler and MES (manufacturing execution system) such as CAMSTAR
- Enter wafer inspection/characterization data and WIP location information into MES
- Interact with engineering for process training and execution of non-standard work instructions on engineering material
- Able to record and verify discrepancies using travelers and MES on all testing processes, make modification and escalate issues if needed.
- Able to stand for duration of shift when needed
- Participate and certify for ERT (emergency response team)
- Ability to provide process training to coworkers using hands-on demonstration
Regular and Temp Positions
- A Shift: 5:00AM-5:00PM; 3-day/4-day (Sunday - Tuesday, every other Wednesday)
- B Shift: 5:00PM-5:00AM; 3-day/4-day (Wednesday - Friday, every other Saturday)
- C Shift: 5:00AM-5:00PM; 3-day/4-day (Thursday - Saturday, every other Wednesday)
- D Shift: 5:00PM-5:00AM; 3-day/4-day (Wednesday - Friday, every other Saturday
